VIEW offers a full line of optical metrology systems for wafer, photomask, slider, MEMS, semiconductor package, HDD suspension, probe card, and micro-component process measurements.
Extra large area dimensional metrology system.
The VIEW Benchmark™ XLT delivers VIEW performance and reliability in a large travel, non-contact, high precision metrology system.
The Benchmark XLT is designed to handle large area parts or nested groups of smaller parts using its moving bridge design. Advanced image processing
The XLT offers extended travel ranging from 900 mm x 1500 mm to 1500 mm x 2000 mm to handle large area parts or nested groups of smaller parts. The XLT's moving bridge design features an open work envelope for loading and unloading large parts.
Advanced optics, illumination, and image processing make the Benchmark XLT a world-class metrology system. Benchmark XLT operates with one or more of VIEW's software packages:
Standard | Optional | |
---|---|---|
X,Y,Z Travel | 624x624x150 mm | 624x624x200 mm |
Load Capacity | 50 kg load evenly distributed on glass 100 kg load evenly distributed on observation platform | |
Imaging Optics | Dual magnification, fixed lens optics with field interchangeable front lens. VIEW 2.5X front lens included as standard. Low mag has 1:1 with front lens; high mag has 4:1 with front lens. | Single magnification, fixed lens optics with factory configurable back tube and field interchangeable front lens. VIEW 1X back tube and 2.5X front lens included as standard. |
Metrology Camera | 1.4 megapixel, 1/2 inch, digital monochrome | 1.4 megapixel, 2/3 inch, digital, monochrome 2.0 megapixel 1/2 inch, digital monochrome |
Illumination | All LED coaxial through-the-lens surface light and below-the-stage back light | Multi-color programmable ring light Grid autofocus system |
Sensor Options | Through-the-lens (TTL) laser Spectra Probe white light range sensor Off-axis triangulation laser | |
Measurement Modes | High Speed Move and Measure (MAM) | Continuous Image Capture (CIC) |