VIEW offers a full line of optical metrology systems for wafer, photomask, slider, MEMS, semiconductor package, HDD suspension, probe card, and micro-component process measurements.
The VIEW Summit systems are designed for components requiring a large work envelope and high accuracy. Based on the same core technologies of optics, high speed linear motors, and high resolution scales used in the VIEW Pinnacle, the Summit features a fixed bridge design. Separate X and Y axis motion systems ensure that neither influences the mechanical integrity of the other, while also enabling easy loading and unloading of large parts
Available in three ranges of travel, the VIEW Summit is ideally suited to for measurement of large footprint parts, such as PCBs, stencils, flat panel displays, etching sheets and mark patterns, or nested groups of smaller parts. The Summit provides very high accuracy and high speed for shop floor process monitoring and quality assurance applications
The Summit systems are ideal for measurement of large format parts requiring high accuracy, such as solder paste stencils and screens, artwork, panelized printed circuit boards, flex circuits, and micro-etched parts.
Summit models can be equipped with an optional through-the-lens or offset mounted laser for added flexibility in Z-axis measurements. Summit models can also utilize the optional SpectraProbe™ offering sub-micron Z-axis measurement resolution
Standard | Optional | |
---|---|---|
X,Y,Z Travel | Model 600 / 450x600x150 mm | |
Load Capacity | Model 600 / 50 kg | |
Imaging Optics | Dual magnification, fixed lens optics with field interchangeable front lens. VIEW 2.5X front lens included as standard. Low mag has 1:1 with front lens; high mag has 4:1 with front lens. | Single magnification, fixed lens optics with factory configurable back tube (1X standard) and field interchangeable front lens options (5X standard). |
Metrology Camera | 1.4 megapixel, 1/2 inch, digital monochrome | 1.4 megapixel, 2/3 inch, digital, monochrome 2.0 megapixel 1/2 inch, digital monochrome |
Illumination | All LED coaxial through-the-lens surface light and below-the-stage back light | Multi-color programmable ring light Grid autofocus system |
Sensor Options | Through-the-lens (TTL) laser Spectra Probe white light range sensor Off-axis triangulation laser | |
Measurement Modes | High Speed Move and Measure (MAM) | Continuous Image Capture (CIC) |